Heat Conduction System Requirement Specification

Functional Requirements

• heat_conduction: Nafems
• 5.1.1The system shall compute the transient heat conduction solution for the NAFEMS T3 benchmark problem using a coarse mesh and
  1. HEX8 elements
  2. HEX20 elements
  3. HEX27 elements
  4. EDGE2 elements
  5. EDGE3 elements
  6. QUAD4 elements
  7. QUAD8 elements
  8. QUAD9 elements
• 5.1.2The system shall compute the transient heat conduction solution for the NAFEMS T3 benchmark problem using a fine mesh and
  1. HEX8 mesh
  2. HEX20 mesh
  3. HEX27 mesh
  4. EDGE2 mesh
  5. EDGE3 mesh
  6. QUAD4 mesh
  7. QUAD8 mesh
  8. QUAD9 mesh

• heat_conduction: Ad Convective Heat Flux
• 5.2.1The system shall provide a convective flux boundary condition which uses material properties as heat transfer coefficients and far-field temperature values using AD
  1. and match hand calculations for flux through a boundary.
  2. and approach a constant far-field temperature value over time as heat flux decreases.
  3. and couple a temperature dependent far-field temperature and heat transfer coefficient.

• heat_conduction: Ad Heat Conduction
• 5.3.1AD heat conduction and the Jacobian shall be beautiful

• heat_conduction: Code Verification
• 5.4.1The MOOSE solutions shall converge to the analytic solutions with an expected order of accuracy (two for linear, three for quadratic) where a standard set of heat conduction problems is used for code verification.

• heat_conduction: Conjugate Heat Transfer
• 5.5.1The system shall correctly model convection heat transfer across internal sidesets aka conjugate heat transfer.

• heat_conduction: Convective Flux Function
• 5.6.1The system shall allow prescribing a convective flux boundary condition using a constant heat transfer coefficient.
• 5.6.2The system shall allow prescribing a convective flux boundary condition using a heat transfer coefficient that is a function of position and time.
• 5.6.3The system shall allow prescribing a convective flux boundary condition using a heat transfer coefficient that is a function of temperature.

• heat_conduction: Convective Heat Flux
• 5.7.1The system shall provide a convective flux boundary condition which uses material properties as heat transfer coefficients and far-field temperature values
  1. and match hand calculations for flux through a boundary.
  2. and approach a constant far-field temperature value over time as heat flux decreases.
  3. and couple a temperature dependent far-field temperature and heat transfer coefficient.

• heat_conduction: Function Ellipsoid Heat Source
• 5.8.1The system shall produce a moving heat source where its path is function dependent

• heat_conduction: Fvbcs
• 5.9.1The system shall be able to solve a heat conduction problem with boundary conditions representing radiation to an infinite cylinder.
• 5.9.2The system shall be able to solve a heat conduction problem with diffusion/conduction/radiation combined thermal resistance boundary conditions.

• heat_conduction: Gap Heat Transfer Htonly
• 5.10.1Thermal contact shall solve plate heat transfer for a constant conductivity gap in 3D
• 5.10.2Thermal contact shall solve plate heat transfer for a constant conductivity gap in 3D using the Modules/HeatConduction/Thermal contact syntax
• 5.10.3Thermal contact shall solve plate heat transfer for a constant conductivity gap in 3D at each iteration
• 5.10.4Thermal contact shall solve cylindrical and plate heat transfer for a constant conductivity gap in 2D axisymmetric coordinates
• 5.10.5Thermal contact shall solve cylindrical heat transfer for a constant conductivity gap in 2D axisymmetric coordinates where the axial axis is along the x-direction
• 5.10.6Thermal contact shall solve spherical heat transfer for a constant conductivity gap in 1D spherically symmetric coordinates
• 5.10.7Thermal contact shall solve cylindrical heat transfer for a constant conductivity gap in 3D
• 5.10.8Thermal contact shall solve cylindrical heat transfer for a constant conductivity gap in the x-y plane
• 5.10.9Thermal contact shall solve spherical heat transfer for a constant conductivity gap in 3D
• 5.10.10Thermal contact shall solve spherical heat transfer for a constant conductivity gap in 2D axisymmetric coordinates
• 5.10.11Thermal contact shall solve cylindrical heat transfer for a constant conductivity gap in the x-z plane
• 5.10.12Thermal contact shall solve cylindrical heat transfer for a constant conductivity gap in the y-z plane
• 5.10.13Thermal contact shall solve plate heat transfer for a constant conductivity gap in the x-y plane
• 5.10.14Thermal contact shall solve plate heat transfer for a constant conductivity gap in the x-z plane
• 5.10.15Thermal contact shall solve plate heat transfer for a constant conductivity gap in the y-z plane

• heat_conduction: Gap Heat Transfer Mortar
• 5.11.1We shall be able to produce the expected result for a gap conductance test case using the mortar method.
• 5.11.2We shall be able to run the mortar method on a displaced mesh, supplying the displacements with constant** auxiliary variables
• 5.11.3The system shall accurately calculate axisymmetric coordinates on mortar finite element segments

• heat_conduction: Gap Heat Transfer Radiation
• 5.12.1The system shall be able to compute heat flux across a gap using the ThermalContact methods

• heat_conduction: Generate Radiation Patch
• 5.13.1The system shall be able to divide a sideset into patches for more accurate radiative transfer modeling.
• 5.13.2The system shall be able to use linear partitioner for subdividing sidesets into patches.
• 5.13.3The system shall be able to use centroid partitioner for subdividing sidesets into patches.
• 5.13.4The system shall error when centroid partitioner is used but centroid_partitioner_direction is not provided.
• 5.13.5The system shall be able to use a uniform grid for subdividing sidesets into patches.
• 5.13.6The system shall be able to use a uniform grid for subdividing 1D sidesets into patches.
• 5.13.7The system shall be able to adjust the number of patches of partitions that end up empty.

• heat_conduction: Gray Lambert Radiator
• 5.14.1The system shall check consistency of boundary and emissivity entries.
• 5.14.2The system shall check consistency of boundary and view factor entries.
• 5.14.3The system shall check consistency of fixed_boundary_temperatures and fixed_temperature_boundary entries.
• 5.14.4The system shall check consistency of boundary and fixed_temperature_boundary entries.
• 5.14.5The system shall check consistency of boundary and adiabatic_boundary entries.
• 5.14.6The system shall check consistency of the view_factors entry shape.
• 5.14.7The system shall check consistency of the view_factors entry norm.
• 5.14.8The system shall compute radiative transfer between gray Lambert surfaces.
• 5.14.9The system shall allow coupling radiative transfer between gray Lambert surfaces to solving heat conduction.
• 5.14.10The system shall allow reconstructing the spatial distribution of the emission component on a radiation boundary via the T4 law.
• 5.14.11The system shall compute radiative transfer between gray Lambert surfaces when the view factors are provided by a userobject.
• 5.14.12The system shall compute radiative transfer between gray Lambert surfaces in 3D when the view factors are provided by a userobject.

• heat_conduction: Heat Conduction
• 5.15.1MOOSE shall compute the heat transfer across small gaps for supported FEM orders and quadratures (QUAD4).
• 5.15.2MOOSE shall compute the heat transfer across small gaps for supported FEM orders and quadratures (QUAD8)
• 5.15.3MOOSE shall compute the heat transfer across small gaps for supported FEM orders and quadratures (QUAD9)
• 5.15.4MOOSE shall compute the heat transfer across small gaps for non-matching meshes.
• 5.15.5MOOSE shall compute the heat transfer across small gaps for second order FEM bases.
• 5.15.6MOOSE shall compute the heat transfer across small gaps for moving interfaces.
• 5.15.7MOOSE shall compute the heat transfer across small gaps with a specified gap conductivity.
• 5.15.8MOOSE shall throw an error if the gap conductance model is used with uniform mesh refinement
• 5.15.9The system shall support thermal contact with linear 3d hexahedral elements
• 5.15.10The system shall support thermal contact with second-order 3d hexahedral elements
• 5.15.11The system shall support thermal contact with 3d hexahedral elements where the surfaces move relative to one another
• 5.15.12The system shall provide convective heat flux boundary condition where far-field temperature and convective heat transfer coefficient are given as constant variables
• 5.15.13The system shall provide convective heat flux boundary condition where far-field temperature and convective heat transfer coefficient are given as spatially varying variables
• 5.15.14The system shall provide convective heat flux boundary condition for multi-phase fluids where far-field temperatures and convective heat transfer coefficients are given as spatially varying variables
• 5.15.15The system shall report an error if the number of alpha components does not match the number of T_infinity components.
• 5.15.16The system shall report an error if the number of htc components does not match the number of T_infinity components.
• 5.15.17The system shall enable scaling of the total heat flux of the convective heat flux boundary condition
• 5.15.18Optionally a constant attenuation shall be applied to compute the gap conductance below a gap length threshold.
• 5.15.19Optionally a linear Taylor expansion of the inverse gap length shall be applied as the attenuation to compute the gap conductance below a gap length threshold.

• heat_conduction: Heat Conduction Ortho
• 5.16.1The system shall allow the use of an anisotropic heat conduction material set by postprocessors.

• heat_conduction: Heat Conduction Patch
• 5.17.1The system shall compute a tri-linear temperature field
• 5.17.2The system shall compute a bi-linear temperature field for an axisymmetric problem with quad8 elements
• 5.17.3The system shall compute a bi-linear temperature field for an axisymmetric problem
• 5.17.4The system shall compute a tri-linear temperature field with hex20 elements
• 5.17.5The system shall compute a tri-linear temperature field with hex20 elements using an anisotropic thermal conductivity model with isotropic thermal conductivities supplied

• heat_conduction: Heat Source Bar
• 5.18.1MOOSE shall reproduce an analytical solution of a heat source in a 1D ceramic bar
• 5.18.2MOOSE shall reproduce an analytical solution of a heat source in a 1D ceramic bar using AD kernels
• 5.18.3The AD heat conduction and heat source Jacobian shall be beautiful

• heat_conduction: Homogenization
• 5.19.1The system shall compute homogenized thermal conductivity using the asymptotic expansion homogenization approach

• heat_conduction: Joule Heating
• 5.20.1The system shall compute Joule heating
• 5.20.2The system shall compute Joule heating using automatic differentiation
• 5.20.3The system shall compute a perfect jacobian for Joule heating using automatic differentiation

• heat_conduction: Meshed Gap Thermal Contact
• 5.21.1The ThermalContact system shall enforce heat transfer across a meshed gap in a 2D plane geometry.
• 5.21.2The ThermalContact system shall correctly enforce heat transfer across a meshed gap in a 2D plane geometry using a prescribed constant conductance.
• 5.21.3The ThermalContact system shall correctly enforce heat transfer across a meshed gap in a 2D plane geometry using a prescribed constant conductance with the quadrature option
• 5.21.4The ThermalContact system shall enforce heat transfer across a meshed circular annulus in a 2D plane geometry.

• heat_conduction: Multiple Contact Pairs
• 5.22.1Heat transfer module action shall allow for providing multiple contact pairs.

• heat_conduction: Multiple Radiation Cavities
• 5.23.1The system shall support the the modeling of radiative heat transfer with multiple radiation cavities.

• heat_conduction: Parallel Element Pps Test
• 5.24.1The system shall computed an integrated value on elements in parallel

• heat_conduction: Postprocessors
• 5.25.1The system shall compute total heat flux from heat transfer coefficient and temperature difference
• 5.25.2The system shall compute total heat flux from heat transfer coefficient and temperature difference for AD variables

• heat_conduction: Radiation Transfer Action
• 5.26.1The system shall provide an action to set up radiative heat transfer problems using the net radiation method for cavities with unobstructed, planar faces.
• 5.26.2The system shall provide an action to set up radiative heat transfer problems using the net radiation method and allow computing view factors using raytracing.
• 5.26.3The system shall allow the specification of boundary names and ids in the modeling of radiative heat transfer.
• 5.26.4The system shall ensure that results between manually created radiative transfer inputs and inputs that use the radiation transfer action are identical.
• 5.26.5The system shall provide an action to set up radiative heat transfer problems where sidesets participating in the radiative exchange are external faces of the domain, with view factors computed by simple quadrature rules for cavities with unobstructed, planar faces.
• 5.26.6The system shall provide an action to set up radiative heat transfer problems where sidesets participating in the radiative exchange are external faces of the domain, with view factors computed by ray tracing.

• heat_conduction: Radiation Transfer Symmetry
• 5.27.1The system shall support the modeling of radiative heat transfer with symmetry boundary conditions by
  1. unfolding the problem at the symmetry boundary and
  2. by using a symmetry boundary condition.

• heat_conduction: Radiative Bcs
• 5.28.1Moose shall be able to model radiative transfer from a cylindrical surface as boundary condition.
• 5.28.2MOOSE shall be able to model radiative transfer from a cylindrical surface as boundary condition with automated differentiation.
• 5.28.3MOOSE shall be able to model radiative transfer from a cylindrical surface as boundary condition with automated differentiation and provide exact Jacobian.
• 5.28.4MOOSE shall be able to model radiative heat transfer using a user-specified emissivity function.
• 5.28.5MOOSE shall be able to model radiative heat transfer using a user-specified emissivity function with automated differentiation.
• 5.28.6MOOSE shall be able to model radiative heat transfer using a user-specified emissivity function with automated differentiation and provide exact Jacobian.

• heat_conduction: Recover
• 5.29.1MOOSE shall run a simulation with heat conduction, a heat source, thermal contact, and boundary conditions.
• 5.29.2MOOSE shall run a short simulation with heat conduction, a heat source, thermal contact, and boundary conditions.
• 5.29.3MOOSE shall be able to recover from a short simulation and reproduce a the full time scale simulation with heat conduction, a heat source, thermal contact, and boundary conditions.
• 5.29.4MOOSE shall run a simulation with heat conduction, a heat source, thermal contact, and boundary conditions with automatic differentiation.
• 5.29.5MOOSE shall run a short simulation with heat conduction, a heat source, thermal contact, and boundary conditions with automatic differentiation.
• 5.29.6MOOSE shall be able to recover from a short simulation and reproduce a the full time scale simulation with heat conduction, a heat source, thermal contact, and boundary conditions with automatic differentiation.

• heat_conduction: Semiconductor Linear Conductivity
• 5.30.1The system shall compute conductivity of semiconductors according to the Steinhart-Hart equation

• heat_conduction: Sideset Heat Transfer
• 5.31.1The system shall solve the side set heat transfer model with:
  1. discontinuous finite elements,
  2. bulk gap temperature as an auxiliary variable,
  3. temperature dependent gap conductivity, and
  4. block restricted continuous finite element variables.
• 5.31.2MOOSE shall throw an error if the inputted boundary does not exist.

• heat_conduction: Transient Heat
• 5.32.1The system shall compute the time derivative term of the heat equation

• heat_conduction: Verify Against Analytical
• 5.33.1Heat conduction shall match the answer from an analytical solution in 1D
• 5.33.2Heat conduction from an AD kernel shall get the same answer as a traditional kernel in 1D
• 5.33.3AD heat conduction and the Jacobian shall be beautiful in 1D
• 5.33.4Heat conduction shall match the answer from an analytical solution in 2D
• 5.33.5Heat conduction from an AD kernel shall get the same answer as a traditional kernel in 2D
• 5.33.6AD heat conduction and the Jacobian shall be beautiful in 2D

• heat_conduction: View Factors
• 5.34.1The system shall compute view factors for unobstructed, planar surfaces without normalization.
• 5.34.2The system shall compute view factors for cavities with obstruction using ray tracing.
• 5.34.3The system shall compute view factors for unobstructed, planar surfaces in two-dimensional meshes using simple quadrature rules.
• 5.34.4The system shall compute view factors for unobstructed, planar surfaces in two-dimensional meshes using ray tracing.
• 5.34.5The system shall compute view factors for unobstructed, planar surfaces in three-dimensional meshes using simple quadrature rules.
• 5.34.6The system shall compute view factors for unobstructed, planar surfaces in three-dimensional meshes using ray tracing.

• heat_conduction: View Factors Symmetry
• 5.35.1The system shall support ensure that symmetry boundary conditions provide exactly the same answer as unfolding the problem about its axis of symmetry.
• 5.35.2The system shall support symmetry boundary conditions for view factor calculations.

Usability Requirements

Performance Requirements

System Requirements